Electronic solder materials

Application: Solder paste is specially used in surface mount technology (SMT) soldering.

Tin particle size: Type 3, 4, 5, 6

Alloy composition: Sn/Ag3.0/Cu0.5, Sn/Ag/Bi,...

Application: Solder bars are commonly used in the wave soldering process.

Alloy composition: Sn/Cu0.7, Sn/Ag0.3/Cu0.7, Sn/Ag3.0/Cu0.5, ...

Classification: High Temp Solder Bar, Low Temp Solder Bar.

Application: Solder wire is widely used in both automatic soldering and manual soldering processes.

Alloy composition: Sn/Cu0.7, Sn/Ag0.3/Cu0.7, Sn/Ag3.0/Cu0.5, ...

Flux Type: Halogen Free, Non-Halogen Free, ROL0, ROL1.

Wire diameter: 0.2mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm,...

Application: Solder flux solution is commonly used in the wave soldering process along with solder bars. Additionally, there are other types applied in the dip soldering process...

Classification: Halogen Free, Non-Halogen Free, ROL0, ROL1, Low Solid Content, High Solid Content, Water Soluble, ...

Application: Tin anode balls are commonly used in the tin plating process for electronic circuit boards.

Classification: Full Ball, Half Ball, diameter 18mm, 20mm, 25mm, ...

SMT Red Glue is utilized to secure electronic components onto the circuit board prior to soldering, forming a strong bond and shielding them from external factors such as vibration and impact.

Package: 10mL, 30mL, and 300ml.